Central Dust Removal System Pulse Backwash Cleaning Vacuum Engineering Application Test Equipment

Central Dust Removal System Pulse Backwash Cleaning Vacuum Engineering Application Test Equipment

Product Introduction

In LED semiconductor production, ultrafine dust (0.1~10μm) generated by processes such as wafer cutting, die bonding, and wire bonding not only pollutes photoresist and affects chip yield, but also endangers workers' respiratory health. VEAT-010 builds an efficient dust control solution through the "pre-separation→fine filtration→automatic dust cleaning" three-level closed-loop system :

• Cyclone pre-separation: dust-laden gas enters the cyclone separator, and coarse particles ≥5μm settle to the dust collection tank due to inertia, reducing the load on the filter element;
• Filter-type fine dust removal: 0.1μm high-efficiency filter element captures ultrafine dust, and the purified gas is discharged through the inner surface;
• Pulse backwash cleaning: The pulse solenoid valve is triggered every 30 minutes (settable), and 0.5MPa compressed air is blown back to the filter element to shake off the accumulated dust (residue ≤5g/m²) and maintain stable filtration efficiency.

The system is equipped with PLC automatic control to monitor filter resistance, air volume, and energy consumption in real time, and is adapted to the 24-hour continuous operation requirements of LED production lines.

International reference standards

• ISO 14644-1:2015: Cleanroom classification Exhaust dust concentration after capture ≤10⁶ particles/m³ (Class 6)
• SEMI S2-0718: Semiconductor equipment safety Pneumatic transmission pressure ≤0.6MPa, anti-leakage design
• GB/T 16292-2010: Air purifier performance 0.1μm particle clean air volume (CADR) ≥800m³/h
• IEC 60335-1: Electrical safety Insulation level IP54, ground resistance ≤0.1Ω

Technical Parameters